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? 2006 california micro devices corp. all rights reserved. 03/15/06 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 1 CM1230 preliminary 2, 4 and 8-channel low capa citance esd protection array features ? 2, 4 and 8 channels of esd protection ? provides esd protection to iec61000-4-2 level 4 ? 8kv contact discharge ? 15kv air discharge ? low loading capacita nce of 0.8pf typical ? minimal capacitance change with temperature and voltage ? channel i/o to gnd capacitance difference of 0.02pf typical is ideal for differential signals ? channel i/o to i/o capacitance 0.15pf typical ? zener diode protects suppl y rail and eliminates the need for external by-pass capacitors ? each i/o pin can withstand over 1000 esd strikes ? available in 4, 6 and 10 bump chip scale pack- ages (csp) ? optiguard ? coated for improved reliability at assembly ? lead-free version available applications ? lcd and camera data lines in wireless handsets that use high-speed serial interfaces. ? i/o port protection for mobile handsets, notebook computers, dscs, mp3 players, pdas, etc. includ- ing usb, 1394 and serial ata ? wireless handsets ? handheld pcs/pdas ? lcd and camera modules product description the CM1230 is a family of 2, 4 and 8 channel, very low capacitance esd protection diode arrays in csp form factor. this device is ideal for protecting systems with high data and clock rates or for circuits that require low capacitive loading. each channel consists of a pair of esd diodes that act as clam p diodes that steer positive or negative esd current pulses to either the positive or negative supply rail. a zener diode is integrated into the array between the positive and negative supply rails. the v cc rail is thus protected from esd strikes and eliminates the need for a bypass capacitor to absorb positive esd strikes to ground. each channel of the CM1230 can safely dissipate esd strikes of 8kv, meeting the level 4 requirement of the iec61000-4-2 international standard for contact dis- charges as well as 15kv air discharges per the iec61000-4-2 specificatio n. using the mil-std-883 (method 3015) specification for human body model (hbm) esd, the pins are protected for contact dis- charges at greater than 15kv. this device is particularly well-suited for next genera- tion wireless handsets that implement high-speed serial interface solutions for the lcd display and cam- era interfaces. in these wireless handset designs, a tolerance above 1.5pf cannot be tolerated due to the high data rates that are transferred between the base- band chipset and the lcd driver/controller ics because a higher capacitiv e loading will cause the rise and fall times to slow which in turn hampers the func- tionality of circuit and operation of the wireless hand- set. the CM1230 incorporates optiguard ? which results in improved reliability at assembly. the CM1230 is available in a space-saving, low profile chip scale package with optional lead-free finishing. electrical schematic ch1 v p v n CM1230-04cs/cp ch4 ch2 ch3 ch1 v p v n CM1230-02cs/cp ch2 ch3 ch6 ch4 ch5 ch1 CM1230-08cs/cp ch8 ch2 ch7 v p v n
? 2006 california micro devices corp. all rights reserved. 2 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 03/15/06 CM1230 preliminary ordering information note 1: parts are shipped in tape & reel form unless otherwise specified. note 2: lead-free devices ar e specified by using a " + " character for the top side orientation mark. 2 1 b a l308 orientation marking (see note 2) 45 3 b5 b4 a4 a5 b3 b2 a2 b1 a1 a3 orientation marking a1 2 1 b a 0 ientation ain (see note 2) 3 b3 a3 b2 b1 a1 a2 orientation marking a1 2 1 b a l orientation marking (see note 2) package / pinout diagrams notes: b2 b1 a1 a2 orientation marking a1 CM1230-02 top view bottom view (bumps down view) (bumps up view) 4-bump csp package 2) lead-free devices are specified by using a " + " character for the top side orientation mark. 1) these drawings are not to scale. CM1230-04 6-bump csp package CM1230-08 10-bump csp package part numbering information standard finish lead-free finish 2 # of channels bumps package ordering part number 1 part marking ordering part number 1 part marking 2 4 csp-4 CM1230-02cs l CM1230-02cp l 4 6 csp-6 CM1230-04cs l30 CM1230-04cp l30 8 10 csp-10 CM1230-08cs l308 CM1230-08cp l308
? 2006 california micro devices corp. all rights reserved. 03/15/06 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 3 CM1230 preliminary pin descriptions pin descriptions pin descriptions (cont?d) 2-channel, 4-bump csp 8-channel, 10-bump csp pin name type description pin name type description a1 v n gnd negative voltage supply rail a1 ch1 i/o esd channel b1 ch2 i/o esd channel b1 ch2 i/o esd channel a2 ch1 i/o esd channel a2 ch3 i/o esd channel b2 v p pwr positive voltage supply rail b2 ch4 i/o esd channel 4-channel, 6-bump csp a3 v p pwr positive voltage supply rail pin name type description b3 v n gnd negative voltage supply rail a1 ch1 i/o esd channel a4 ch5 i/o esd channel b1 ch2 i/o esd channel b4 ch6 i/o esd channel a2 v p pwr positive voltage supply rail a5 ch7 i/o esd channel b2 v n gnd negative voltage supply rail b5 ch8 i/o esd channel a3 ch3 i/o esd channel b3 ch4 i/o esd channel
? 2006 california micro devices corp. all rights reserved. 4 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 03/15/06 CM1230 preliminary specifications note 1: all parameters specified at t a = -40c to +85c unless otherwise noted. note 2: these parameters guaranteed by design and characterization. note 3: human body model per mil-std-883, method 3015, c discharge = 100pf, r discharge = 1.5k , v p = 3.3v, v n grounded. note 4: standard iec 61000-4-2 with c discharge = 150pf, r discharge = 330 , v p = 3.3v, v n grounded. note 5: these measurements performed with no external capacitor on v p . note 6: measured under pulsed conditions, pulse width = 0.7ms, maximum current = 1.5a. absolute maximum ratings parameter rating units operating supply voltage (v p - v n )6.0v operating temperature range -40 to +85 c storage temperature range -65 to +150 c dc voltage at any channel input (v n - 0.5) to (v p + 0.5) v standard operat ing conditions parameter rating units operating temperature range -40 to +85 c electrical operating characteristics (see note 1) symbol parameter conditions min typ max units v p operating supply voltage (v p -v n )3.35.5v i p operating supply current (v p -v n )=3.3v 8.0 a v f diode forward voltage top diode bottom diode i f = 8ma; t a =25c 0.60 0.60 0.80 0.80 0.95 0.95 v v i leak channel leakage current t a =25c; v p =5v, v n =0v, v in = 0v to 5v 0.1 1.0 a c in channel input capacitance at 1 mhz, v p =3.3v, v n =0v, v in =1.65v; note 2 applies 0.8 1.20 pf c in channel input capacitanc e matching at 1 mhz, v p =3.3v, v n =0v, v in =1.65v; note 2 applies 0.02 pf c mutual mutual capacitance between signal pin and adjacent signal pin at 1 mhz, v p =3.3v, v n =0v, v in =1.65v; note 2 applies 0.15 pf v esd in-system esd protection peak discharge voltage at any channel input, in system a) contact discharge per iec 61000-4-2 standard b) human body model, mil- std-883, method 3015 notes 2, 4 & 5; t a =25c notes 2, 3 & 5; t a =25c 8 15 kv kv v cl channel clamp voltage positive transients negative transients t a =25c, i pp = 1a, t p = 8/20 s; notes 2, & 5 +9.8 -1.8 v v r dyn dynamic resistance positive transients negative transients i pp = 1a, t p = 8/20 s any i/o pin to ground; note 2 and 5 0.76 0.56
? 2006 california micro devices corp. all rights reserved. 03/15/06 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 5 CM1230 preliminary performance information input channel capacitance performance curves 0.60 0.65 0.70 0.75 0.80 0.85 0.90 -50 -25 0 25 50 75 100 temperature ['c] capacitance [pf] 0v dc input bias 1.65 dc input bias typical variation of c in vs. v in (f=1mhz, v p = 3.3v, v n = 0v, 0.1 f chip capacitor between v p and v n, t a = 25c ) typical variation of c in vs. temp (f=1mhz, v in =30mv, v p = 3.3v, v n = 0v, 0.1 f chip capacitor between v p and v n ) 0.000 0.200 0.400 0.600 0.800 1.000 1.200 1.400 1.600 1.800 2.000 0 0.5 1 1.5 2 2.5 3 bias voltage (v) capacitance (pf)
? 2006 california micro devices corp. all rights reserved. 6 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 03/15/06 CM1230 preliminary performance information (cont?d) typical filter performance (nominal conditions unless specified otherwise, 50 ohm environment) insertion loss vs. frequency (0v dc bias, v p =3.3v) insertion loss vs. frequency (2.5v dc bias, v p =3.3v)
? 2006 california micro devices corp. all rights reserved. 03/15/06 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 7 CM1230 preliminary application information refer to application no te ap-217, "the chip scale package", for a detailed description of chip scale packages offered by california micro devices. figure 1. recommended non-solder mask defined pad illustration figure 2. eutectic (snpb) solder ball reflow profile figure 3. lead-free (snagcu) solder ball reflow profile printed circuit boar d recommendations parameter value pad size on pcb 0.275mm pad shape round pad definition non-solder mask defined pads solder mask opening 0.325mm round solder stencil thickness 0.125mm - 0.150mm solder stencil aperture opening (las er cut, 5% tapered walls) 0.330mm round solder flux ratio 50/50 by volume solder paste type no clean pad protective finish osp (entek cu plus 106a) tolerance ? edge to corner ball + 50 m solder ball side coplanarity + 20 m maximum dwell time above liquidous (183c) 60 seconds maximum soldering temperature for a eutectic device using eutectic solder paste 240c maximum soldering temperature for a lead-fr ee device using lead-free solder paste 260c solder mask opening 0.325mm dia. non-solder mask defined pad 0.275mm dia. solder stencil opening 0.330mm dia. 200 250 150 100 50 0 1:00.0 2:00.0 3:00.0 4:00.0 time (minutes) temperature (c)
? 2006 california micro devices corp. all rights reserved. 8 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 03/15/06 CM1230 preliminary mechanical details csp-4 mechanical specifications the CM1230-02cs/cp is supplied in a 4 bump chip scale package (csp). dimensions are shown below. for complete information on the csp, see the califor- nia micro devices csp package information docu- ment. package dimensions for CM1230-02 chip scale package package dimensions package custom csp bumps 4 dim millimeters inches min nom max min nom max a1 0.915 0.960 1.005 0.0360 0.0378 0.0396 a2 0.915 0.960 1.005 0.0360 0.0378 0.0396 b1 0.495 0.500 0.505 0.0195 0.0197 0.0199 b2 0.495 0.500 0.505 0.0195 0.0197 0.0199 c1 0.180 0.230 0.280 0.0071 0.0091 0.0110 c2 0.180 0.230 0.280 0.0071 0.0091 0.0110 d1 0.575 0.644 0.714 0.0226 0.0254 0.0281 d2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel 3500 pieces controlling dimension: millimeters mechanical package diagrams a b 1 c1 b1 a1 c2 dimensions in millimeters d1 d2 a2 bottom view side view 2 b2 0.30 dia. 63/37 sn/pb (eutectic) or solder bumps 96.8/2.6/0.6 sn/ag/cu (lead-free) optiguard tm coating
? 2006 california micro devices corp. all rights reserved. 03/15/06 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 9 CM1230 preliminary mechanical details (cont?d) csp-6 mechanical specifications the CM1230-04cs/cp is supplied in a 6 bump chip scale package (csp). dimensions are shown below. for complete information on the csp, see the califor- nia micro devices csp package information docu- ment. package dimensions for CM1230-04 chip scale package package dimensions package custom csp bumps 6 dim millimeters inches min nom max min nom max a1 0.915 0.960 1.005 0.0360 0.0378 0.0396 a2 1.415 1.460 1.505 0.0557 0.0575 0.0593 b1 0.495 0.500 0.505 0.0195 0.0197 0.0199 b2 0.495 0.500 0.505 0.0195 0.0197 0.0199 c1 0.180 0.230 0.280 0.0071 0.0091 0.0110 c2 0.180 0.230 0.280 0.0071 0.0091 0.0110 d1 0.575 0.644 0.714 0.0226 0.0254 0.0281 d2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel 3500 pieces controlling dimension: millimeters 1 2 3 b c1 b1 a1 b2 c2 0.30 dia. note: dimensions in millimeters d1 d2 a2 bottom view side view a b3 63/37 sn/pb (eutectic) or solder bumps 95.5/3.8/0.7 sn/ag/cu (lead-free) optiguard tm coating mechanical package diagrams
? 2006 california micro devices corp. all rights reserved. 10 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 03/15/06 CM1230 preliminary mechanical details (cont?d) csp-10 mechanical specifications the CM1230-08cs/cp is supplied in a 10 bump chip scale package (csp). dimensions are shown below. for complete information on the csp, see the califor- nia micro devices csp package information docu- ment. package dimensions for CM1230-08 chip scale package package dimensions package custom csp bumps 10 dim millimeters inches min nom max min nom max a1 0.915 0.960 1.005 0.0360 0.0378 0.0396 a2 2.415 2.460 2.505 0.0951 0.0969 0.0986 b1 0.495 0.500 0.505 0.0195 0.0197 0.0199 b2 0.495 0.500 0.505 0.0195 0.0197 0.0199 c1 0.180 0.230 0.280 0.0071 0.0091 0.0110 c2 0.180 0.230 0.280 0.0071 0.0091 0.0110 d1 0.575 0.644 0.714 0.0226 0.0254 0.0281 d2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel 3500 pieces controlling dimension: millimeters mechanical package diagrams 0.30 dia. note: dimensions in millimeters 63/37 sn/pb (eutectic) or solder bumps 95.5/3.8/0.7 sn/ag/cu (lead-free) optiguard tm coating 4 5 b c1 b1 a1 b2 c2 d1 d2 a2 bottom view side view a 1 2 3 a b
? 2006 california micro devices corp. all rights reserved. 03/15/06 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 11 CM1230 preliminary csp tape and reel specifications figure 4. tape and reel mechanical data part number chip size (mm) pocket size (mm) b 0 x a 0 x k 0 tape width w reel diameter qty per reel p 0 p 1 CM1230-02 0.96 x 0.96 x 0.644 1.14 x 1.00 x 0.70 8mm 178mm (7") 3500 4mm 4mm CM1230-04 1.46 x 0.96 x 0.644 1.72 x 1.17 x 0.73 8mm 178mm (7") 3500 4mm 4mm CM1230-08 2.46 x 0.96 x 0.644 2.62 x 1.12 x 0.76 8mm 178mm (7") 3500 4mm 4mm top for tape feeder reference cover tape p 1 only including draft. concentric around b. k o embossment user direction of feed 0.2 mm p o center lines of cavity w 10 pitches cumulative tolerance on tape a o b o

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